AMAOE EMMC EMCP Font BGA chip reballing stencil 0.15MM steel mesh for BGA153/162/169/186/221/254 Item NO.: 1318330

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Product Name	AMAOE EMMC EMCP Font BGA chip reballing stencil 0.15MM steel mesh for BGA153/162/169/186/221/254
Item NO.	1318330
Smart device Brand	Android, Samsung
BGA reballing kit	Stencil
Weight	0.04 kg = 0.0882 lb = 1.4110 oz
Category	Phone repair tools > BGA reballing kit
Tag	EMMC , 0.15mm , BGA , eMCP , 162 , EMMC stencil , 0.15mm stencil , 254 , 153 , BGA153 , BGA254 , BGA162 , BGA221 , BGA169 , BGA186 , font stencil , Font , Samsung Font stencil , BGA chip stencil , EMCP stencil , AMAOE font stencil , Samsung BGA stencil , Android front stencil , Android BGA stencil , 0.15MM font stencil , BGA chip , 0.15MM steel mesh , BGA221 stencil , 221 , BGA153 stencil , BGA169 stencil , 169 , BGA254 stencil , BGA162 stencil , BGA186 stencil , 186
Brand	AMAOE
Creation Time	2020-06-22