Product Name | BEST-509 80g Tin solder Paste for BGA SMT reflow medium temperature solder paste for mobile phone repair |
Item NO. | 1238776 |
BGA reballing kit | Solder flux paste |
Weight | 0.29 kg = 0.6393 lb = 10.2294 oz |
Category | Phone repair tools > BGA reballing kit |
Tag | solder paste , medium temperature solder paste , paste , Tin solder Paste , best paste |
Brand | BST |
Creation Time | 2020-08-14 |
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