Product Name | Lead-Free Tin Paste Low Temperature And High Temperature Melting Point Tin Paste CPU Repair |
Item NO. | 944842 |
BGA reballing kit | Solder flux paste |
Weight | 0.07 kg = 0.1543 lb = 2.4692 oz |
Category | Phone repair tools > BGA reballing kit |
Tag | V8B45 , V5B45 , V3B45 , V4B45 , V8S35 , V5S35 , V4S35 , V3S35 , solder paste , solder flux , lead free paste , 138℃ , 138° |
Brand | MECHANIC |
Creation Time | 2019-05-21 |
The following models of temperature series:
V8B45 (60g) 138℃
V8S35 (60g) 217℃
V3B45 (20g) 138℃
V3S35 (20g) 217℃
V5B45 (42g) 138℃
V5S35 (42g) 217℃
V4B45 (40g) 138℃
V4S35 (40g) 217℃
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