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AddressCompany:Shenzhen Tuoli Electronic Technology Co.,Ltd.
Address:Floor 6, Building B, Baifuli Industrial Park, Shanghenglang Industrial Zone,
Dalang Street, Longhua District, Shenzhen
Service Hotline:008618899777586 (WhatsApp)
E-mail:Service@tuolitech.com


MECHANIC ix7 full sets A8 A9 A10 A11 A12 Mainboard CPU IC Chip Glue Removal Layering And Bonding BGA Reballing Platform ix7

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MECHANIC ix7 full sets A8 A9 A10 A11 A12 Mainboard CPU IC Chip Glue Removal Layering And Bonding BGA Reballing Platform ix7 Item NO.: 779381

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US$ 3.88
Model:
iX7 A8 A9 A10 A11 A12
Quantity:
Stock ( 59999974 )
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Product Name MECHANIC ix7 full sets A8 A9 A10 A11 A12 Mainboard CPU IC Chip Glue Removal Layering And Bonding BGA Reballing Platform ix7
Item NO. 779381
BGA reballing kit Stencil, Tin planting platform
Motherboard repair fixture Heating platform
Weight 0.5 kg = 1.1023 lb = 17.6370 oz
Category Phone repair tools
Tag ix7 , X7 , 7 IX7 , chip glue remove platform
Brand MECHANIC
Creation Time 2019-01-09

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