Product Name | MECHANIC ix7 full sets A8 A9 A10 A11 A12 Mainboard CPU IC Chip Glue Removal Layering And Bonding BGA Reballing Platform ix7 |
Item NO. | 779381 |
BGA reballing kit | Stencil, Tin planting platform |
Motherboard repair fixture | Heating platform |
Weight | 0.5 kg = 1.1023 lb = 17.6370 oz |
Category | Phone repair tools |
Tag | ix7 , X7 , 7 IX7 , chip glue remove platform |
Brand | MECHANIC |
Creation Time | 2019-01-09 |
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