Product Name | MIJNNG iRepair HY-258 LO Solder paste solder paste mobile phone maintenance environmental protection lead-free antioxidant |
Item NO. | 1616506 |
Glue liquid solution | Repair glue |
Weight | 0.11 kg = 0.2425 lb = 3.8801 oz |
Category | Phone repair tools > BGA reballing kit |
Tag | solder paste , bga welding , HY-258 , irepair solder paste |
Brand | iRepair |
Creation Time | 2020-12-03 |
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