MJ CPU Stencil For Huawei Series BGA Kirin HI CPU WTR WFR dislocation hole Item NO.: 862261

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Product Name	MJ CPU Stencil For Huawei Series BGA Kirin HI CPU WTR WFR dislocation hole
Item NO.	862261
Smart device Brand	Huawei
BGA reballing kit	Stencil
Weight	0.02 kg = 0.0441 lb = 0.7055 oz
Category	Parts Consumables > Motherboard parts
Tag	HUAWEI Mate8 , HUAWEI Mate9 , HUAWEI Mate10 , HUAWEI Mate9PRO , HUAWEI Mate10Pro , HUAWEI P9 , HUAWEI P10 , HUAWEI P20 , Honor V10 , P20CPU , 20PRO CPU , MATE10CPU , 10PRO CPU , RSCPU , 10CPU , V10-KIRIN 970CPU , HI3670CPU , P10CPU , CPU Stencil , 10PCPU , MATE9CPU , 9PROCPU , NOVA2SCPU , 9CPU , V9-KIRIIN960CPU , HI3660CPU , MT8CPU , P9CPU-HI CPU , HI Power CPU , EMMC CPU , EMCP-QUALCOMM WTR IC CPU , WTR3925 , WTR4905 , Hi6522 , hi6555 , HI6523 , Huawei stencil , HI6250 , HI6220 , HI3670 , HI3660 , HI6620 , MJ CPU stencil , MJ stencil , WTR5975 , HI6422 , WTR2965 , WTR2955 , Mijing stencil , honor V9 , mt8 , Honor 9 , Kirin960 , KIRIN970 , Huawei CPU stencil , BGA153 , BGA254 , Mijing CPU stencil , HW-1 , HW-2 , HW-3 , HW-4 , Huawei P20 pro , Huawei RS , Honor 10 , Huawei P10P , Huawei Nova2 , HI CPU , HI3660B , HI3660A , HI6421A , HI6421B , HI6551 , HI6421GFC , HI6553 , BGA162 , HI6561 , BGA221 , BGA169 , WTR1625 , WTR1625/L , WTR3905 , WFR1620 , WTR4605 , WFR2600 , WTR2605 , WTR2100 , BGA186 , WTR1605/L , Dislocation hole , 0.35 , 0.45 , 0.4 , 0.4/45 , 0.35/45
Brand	Mijing
Creation Time	2019-03-29