WYLIE universal domestic bga reballing stencil for Android Item NO.: 1134513

US$ 3.10

Product Name	WYLIE universal domestic bga reballing stencil for Android
Item NO.	1134513
Smart device Brand	Android, Oppo, XiaoMi, LG, Huawei, Samsung
BGA reballing kit	Stencil
Weight	0.01 kg = 0.0220 lb = 0.3527 oz
Category	Phone repair tools
Tag	CPU , CPU Stencil , Xiaomi , Huawei , Vivo , Oppo , HI1102 , Hi6522 , hi6555 , 6555 , PM , 8998 , wifi , 8845 SDM845 , EMMC 6IN 1 , Kirin980 Hi3680 CPU , Kirin980 , Hi3680 , HUAWEI Hi Power , Qualcomm PM Power , 855 SM8150 CPU , SM8150 , Wxynos9810 CPU , iPM/MTK-MT , R9P/R9S Plus , vivo X6/X7/X9 , 0.3/0.35/0.4/0.5 , MSM8956/8992 CPU , MSM8996/ 8998 , MTK、SDM , BGA reballing stencil , MSM8992 , MSM8996 , MSM8998 , Android stencil , Vivo stencil , Xiaomi stencil , SDM845 , MSM8956 , Huawei stencil , HI3670 , PM640 , PM540 , PM845 , PM670 , Hi6421 , HI6422 , HI6423 , PM660 , HI6362 , HI6363 , Hi1101 , 845 , PM670A , 8996 , 8956 , 3680 , PM power , KIRIN970 , Android CPU stencil , Samsung stencil , BGA153 , 8150 , WIFI stencil , IF ic stencil , IF , 8992 , 3670 , 970 , 980 , HI6559 , HI6403 , HI1103 , HI6353 , PM8150C , PM562 , PM6150 , PM6150L , PM660A , PM8150B , PM8150A , PM1632 , PM8150 , PM449 , PM660D , 0PM4630 , 0PM2622 , 77661-11 , AFEM-9070 , AFEM9070 , SDR8150 , Oppo stencil , LG stencil , EMIC
Brand	WYLIE
Creation Time	2020-03-10