SAFE & SECURE

Order Detail

  • Order NumberTUOLI201909271328899
  • Creation time2019-09-27 08:29:14
  • Shipping MethodHongkong DHL
  • Payment MethodPayPal
  • StatusCompleted
  • CountryCanada
  • Tracking NumberHongkong DHL : 859151****
  • Product PriceUSD 306.638
  • Discount PriceUSD 0.000
  • Shipping CostUSD 74.381
  • Weight9.442 Kg
  • InsuranceUSD 0.191
  • Payment FeeUSD 17.155
  • Total PriceUSD 398.365

Cart Summary

Goods Price Qty Subtotal
Mechanic Apple IPX/XS/XR/Xs MAX Royal Solder Paste 148 Degree Tin Pulp Lead-Free Low Temperature Tin Mud
395020
Model:XP5(42g)148°
Weight:0.1 X 1 = 0.1 Kg
USD 3.912 1 USD 3.912
MECHANIC 3D Arc Steel Stencil iphone5G/5S 6G/6P 6S/6SP 7G/7P 8G/8P X XS/MAX/XR
472960
Model:X
Weight:0.15 X 1 = 0.15 Kg
USD 3.368 1 USD 3.368
MECHANIC 3D Arc Steel Stencil iphone5G/5S 6G/6P 6S/6SP 7G/7P 8G/8P X XS/MAX/XR
472960
Model:XS/MAX/XR
Weight:0.15 X 1 = 0.15 Kg
USD 3.368 1 USD 3.368
MIJING CPU Stencil For Samsung S serires
862074
Model:SAM-4
Weight:0.02 X 1 = 0.02 Kg
USD 3.750 1 USD 3.750
MIJING CPU Stencil For Samsung S serires
862074
Model:SAM-1
Weight:0.02 X 1 = 0.02 Kg
USD 3.750 1 USD 3.750
MIJING CPU Stencil For Samsung S serires
862074
Model:SAM-5
Weight:0.02 X 1 = 0.02 Kg
USD 3.750 1 USD 3.750
MIJING CPU Stencil For Samsung S serires
862074
Model:SAM-6
Weight:0.02 X 1 = 0.02 Kg
USD 3.750 1 USD 3.750
MECHANIC BGA/IC glue removing liquid QC-20
405966
Weight:0.15 X 1 = 0.15 Kg
USD 2.249 1 USD 2.249
Rust Removing Pen Clean Brush PCB Cleaner Repair Tools for Mobile Phones PC Motherboards Circuit Boards
779947
Weight:0.03 X 2 = 0.06 Kg
USD 1.050 2 USD 2.100
0.8mm IPhone X PCB Repair Heat Insulation Glass Fiber Shield Protector
471121
Weight:0.001 X 2 = 0.002 Kg
USD 0.648 2 USD 1.296
MECHANIC 3D planting tin steel mesh Suitable for Apple motherboard X/XS/XSM middle layer groove positioning in addition to plastic planting tin
432631
Model:3D Stencils
Weight:0.2 X 1 = 0.2 Kg
USD 2.170 1 USD 2.170
MECHANIC 3D planting tin steel mesh Suitable for Apple motherboard X/XS/XSM middle layer groove positioning in addition to plastic planting tin
432631
Model:3D-X
Weight:0.31 X 1 = 0.31 Kg
USD 5.376 1 USD 5.376
MECHANIC 3D planting tin steel mesh Suitable for Apple motherboard X/XS/XSM middle layer groove positioning in addition to plastic planting tin
432631
Model:3D-XS Pro Steel mesh
Weight:3 X 1 = 3 Kg
USD 7.847 1 USD 7.847
MECHANIC 3D planting tin steel mesh Suitable for Apple motherboard X/XS/XSM middle layer groove positioning in addition to plastic planting tin
432631
Model:3D-XS-M Pro
Weight:0.2 X 1 = 0.2 Kg
USD 13.908 1 USD 13.908
MECHANIC 3D planting tin steel mesh Suitable for Apple motherboard X/XS/XSM middle layer groove positioning in addition to plastic planting tin
432631
Model:3D-XS Pro
Weight:0.71 X 1 = 0.71 Kg
USD 9.349 1 USD 9.349
MECHANIC 3D planting tin steel mesh Suitable for Apple motherboard X/XS/XSM middle layer groove positioning in addition to plastic planting tin
432631
Model:3D-X Pro
Weight:0.51 X 1 = 0.51 Kg
USD 7.045 1 USD 7.045
Qianli JP-19 For iPhone X XS XS-MAX Motherboard layering Upper and lower Rapid Separation Disassembly Platform Glue Removing Fixture
536914
Weight:0.5 X 1 = 0.5 Kg
USD 32.700 1 USD 32.700
QIANLI MEGA IDEA MainBoard Layered Testing Frame For IPhone X XS MAX Middle Level Radio Frequency Logic Board Function Tester
503815
Model:For Iphone X/Xs/Xs Max (with tips)
Weight:1 X 1 = 1 Kg
USD 172.350 1 USD 172.350
MJ BGA Reballing Middle Middle-level Frame For IPhone X Repair Logic Board Separate
832438
Model:Xs/Xs-max
Weight:0.5 X 2 = 1 Kg
USD 2.400 2 USD 4.800
MJ BGA Reballing Middle Middle-level Frame For IPhone X Repair Logic Board Separate
832438
Model:X
Weight:0.5 X 2 = 1 Kg
USD 1.800 2 USD 3.600
MIJING Z13 BGA REBALLING FIXTURE FOR IPHONE X/XS/XSMAX
908808
Weight:0.32 X 1 = 0.32 Kg
USD 16.200 1 USD 16.200

Tracking Number

Hongkong DHL:859151****

HONG KONG - HONG KONG, Shipment picked up

2019-10-04 21:59:00

HONG KONG - HONG KONG, Departed Facility in HONG KONG - HONG KONG

2019-10-05 00:37:00

HONG KONG - HONG KONG, Arrived at Sort Facility HONG KONG - HONG KONG

2019-10-05 02:12:00

CINCINNATI HUB, OH - USA, Customs status updated

2019-10-05 08:48:00

HONG KONG - HONG KONG, Processed at HONG KONG - HONG KONG

2019-10-05 08:55:00

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