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AddressCompany:Shenzhen Tuoli Electronic Technology Co.,Ltd.
Address:Floor 6, Building B, Baifuli Industrial Park, Shanghenglang Industrial Zone,
Dalang Street, Longhua District, Shenzhen
Service Hotline:008618899777586 (WhatsApp)
E-mail:Service@tuolitech.com


Qianli 3D Metal BGA Reballing Stencil Platform for iPhone X/XS/MAX 11 Pro Max Motherboard Middle Layer Planting Tin Template Net

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Qianli 3D Metal BGA Reballing Stencil Platform for iPhone X/XS/MAX 11 Pro Max Motherboard Middle Layer Planting Tin Template Net Item NO.: 1303818

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US$ 16.21
Model:
IP-01 IP-02
Quantity:
Stock ( 19999987 )
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Product Name Qianli 3D Metal BGA Reballing Stencil Platform for iPhone X/XS/MAX 11 Pro Max Motherboard Middle Layer Planting Tin Template Net
Item NO. 1303818
Smart device Brand iPhone
BGA reballing kit Stencil, Tin planting platform
Weight 0.3 kg = 0.6614 lb = 10.5822 oz
Category Phone repair tools
Tag xs , X , xsmax , 11promax , 11 , 11pro , 3D stencil , middle layer , X/XS/XSMAX , BGA reballing stencil , iPhone stencil , tin plant plate , iPhone 3D stencil , IP-01 , IP-02 , 3D stencil plate , middile layer reballing , motherboard middle layer reballing stencil , 3D stencil platform , iPhone middle layer stencil , ip01 , ip02
Brand Qianli
Creation Time 2020-06-06

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