Product Name | AMAOE PM:3 Qualcomm PM Power 0.12MM reballing stencil Samsung PM IC series steel mesh PM6150 PM6150L PM562 PM660 PM670 PM8150A PM845 PM540 PM1632 PM640 PM8150 PM489 PM5600 PM3 steel net |
Item NO. | 1318282 |
Smart device Brand | Android, Samsung |
BGA reballing kit | Stencil |
Weight | 0.04 kg = 0.0882 lb = 1.4110 oz |
Category | Phone repair tools > BGA reballing kit |
Tag | 5600 , 660 , PM , 562 , 489 , 6150 , Qualcomm PM Power , 640 , 0.12mm stencil , 0.12mm , PM640 , PM540 , PM845 , PM670 , PM660 , 540 , 845 , 670 , PM IC , PM power , Samsung stencil , Qualcomm , 8150 , PM562 , PM6150 , PM6150L , PM8150A , PM1632 , PM8150 , PM stencil , Qualcomm PM Power stencil , PM Power stencil , Qualcomm stencil , AMAOE 0.12MM stencil , PM3 , PM IC steel mesh , 0.12MM PM stencil , Samsung 0.12MM stencil , AMAOE Samsung stencil , PM5600 , PM489 , 1632 , 8150A , 6150L , 0.40✖16✖16 , 0.35✖12✖12 |
Brand | AMAOE |
Creation Time | 2020-06-22 |
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