Product Name | RELIFE F-20 Solder Paste Flux Lead-Free NO-Clean SMD Soldering Flux for Phone Soldering PCB BGA SMD Rework Repair |
Item NO. | 1478455 |
Glue liquid solution | Motherboard glue remove liquid |
Weight | 0.11 kg = 0.2425 lb = 3.8801 oz |
Category | Phone repair tools > BGA reballing kit |
Tag | Relife , F-20 , F20 |
Brand | RELIFE |
Creation Time | 2020-08-29 |
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