MECHANIC ix7 full sets A8 A9 A10 A11 A12 Mainboard CPU IC Chip Glue Removal Layering And Bonding BGA Reballing Platform ix7 Item NO.: 779381

Write a Review Sold (147)

US$ 3.88

Model:

Quantity:: Stock ( 59999974 )

Shipping Cost:: Estimate Shipping Cost

Product Name	MECHANIC ix7 full sets A8 A9 A10 A11 A12 Mainboard CPU IC Chip Glue Removal Layering And Bonding BGA Reballing Platform ix7
Item NO.	779381
BGA reballing kit	Stencil, Tin planting platform
Motherboard repair fixture	Heating platform
Weight	0.5 kg = 1.1023 lb = 17.6370 oz
Category	Phone repair tools
Tag	ix7 , X7 , 7 IX7 , chip glue remove platform
Brand	MECHANIC
Creation Time	2019-01-09