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AddressCompany:Shenzhen Tuoli Electronic Technology Co.,Ltd.
Address:Floor 6, Building B, Baifuli Industrial Park, Shanghenglang Industrial Zone,
Dalang Street, Longhua District, Shenzhen
Service Hotline:008618899777586 (WhatsApp)
E-mail:Service@tuolitech.com


620pcs small directly heating stencil kits for all laptop mobile xbox ic chipsets

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620pcs small directly heating stencil kits for all laptop mobile xbox ic chipsets Item NO.: 781068

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US$ 84.75
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Product Name 620pcs small directly heating stencil kits for all laptop mobile xbox ic chipsets
Item NO. 781068
Smart device Brand Laptop, Android, ZTE, Moto, Nokia, Meizu, Sony, Oppo, Vivo, XiaoMi, LG, One Plus, Huawei, Samsung, iPhone
BGA reballing kit Stencil
Weight 1.5 kg = 3.3069 lb = 52.9109 oz
Category Phone repair tools
Tag BGA stencil , BGA stencil kit , 620 pcs stencil , heating stencil kits , laptop stencil , mobile stencil
Brand Others
Creation Time 2019-01-10

These templates were manufactured with high quality material, with the machine 

can be heated by hot air, it is easy and fast to flip the BGA IC again.


Features:
They are made of high quality Stainless steel quality, the thickness of the steel mesh is perfect.
They can be heated with the hot air machine, these templates are not easy to deform when heated.
620 small direct heating template kits meet your diverse needs.
The specifications are marked on the surface, it is convenient that you choose.

It is specially designed for laptop, desktop, main communication board

 north-south bridge, and graphics card, etc. All kinds of BGA chips.


Specification:
Stainless steel material: stainless steel
Silver color
Quantity: 620pcs
Weight: approximately 268g

List of packages:
3 pieces x templates BGA pieces for 0.35mm Welding Ball
2 pieces x templates BGA pieces for 0.4mm Welding Ball
7 pieces x BGA insoles for 0.45mm Welding Ball
35 pieces x templates BGA pieces for 0.5mm Solder Ball
60 pieces x BGA templates for 0.6mm Solder Ball

23 pieces x BGA templates for 0.76mm Welding Ball


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