Product Name | 620pcs small directly heating stencil kits for all laptop mobile xbox ic chipsets |
Item NO. | 781068 |
Smart device Brand | Laptop, Android, ZTE, Moto, Nokia, Meizu, Sony, Oppo, Vivo, XiaoMi, LG, One Plus, Huawei, Samsung, iPhone |
BGA reballing kit | Stencil |
Weight | 1.5 kg = 3.3069 lb = 52.9109 oz |
Category | Phone repair tools |
Tag | BGA stencil , BGA stencil kit , 620 pcs stencil , heating stencil kits , laptop stencil , mobile stencil |
Brand | Others |
Creation Time | 2019-01-10 |
These templates were manufactured with high quality material, with the machine
can be heated by hot air, it is easy and fast to flip the BGA IC again.
It is specially designed for laptop, desktop, main communication board
north-south bridge, and graphics card, etc. All kinds of BGA chips.
23 pieces x BGA templates for 0.76mm Welding Ball
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