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AddressCompany:Shenzhen Tuoli Electronic Technology Co.,Ltd.
Address:Floor 6, Building B, Baifuli Industrial Park, Shanghenglang Industrial Zone,
Dalang Street, Longhua District, Shenzhen
Service Hotline:008618899777586 （WhatsApp）
E-mail:Service@tuolitech.com


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MJ Medium temperature high temperature tin paste for Phone NAND Flash CPU wifi chip ic Planted tin BGA repair solder paste

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MJ Medium temperature high temperature tin paste for Phone NAND Flash CPU wifi chip ic Planted tin BGA repair solder paste Item NO.: 831827

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US$ 2.33
Model:
501A 50g 503A 50g 501B 30g 503B 30g
temperature:
Low temperature Medium temperature
Quantity:
Stock ( 39999990 )
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Product Name MJ Medium temperature high temperature tin paste for Phone NAND Flash CPU wifi chip ic Planted tin BGA repair solder paste
Item NO. 831827
BGA reballing kit Solder flux paste
Weight 0.5 kg = 1.1023 lb = 17.6370 oz
Category Phone repair tools > BGA reballing kit
Tag 501a , 503a , 501B , 503B , solder paste , solder flux , solder flux paste , MJ solder paste , medium temperature solder paste , high temperature solder paste
Brand Mijing
Creation Time 2019-02-21

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AddressCompany:Shenzhen Tuoli Electronic Technology Co.,Ltd.
Address:Floor 6, Building B, Baifuli Industrial Park, Shanghenglang Industrial Zone,
Dalang Street, Longhua District, Shenzhen
Service Hotline:008618899777586 （WhatsApp）
E-mail:Service@tuolitech.com