Product Name | MJ Qualcom MTK CPU Stencil |
Item NO. | 862185 |
Smart device Brand | Android, iPhone |
BGA reballing kit | Stencil |
Weight | 0.02 kg = 0.0441 lb = 0.7055 oz |
Category | Parts Consumables > Motherboard parts |
Tag | QU-1(Qualcom com cpu) , PM-1(Qualcom com PM Power) , QU-2(Qualcom cpu) , MT-1(MTK cpu) , QU-3(Qualcom cpu) , MT-2(MTK MT Power IC) , QU-4(Qualcom cpu) , MAX-1(MAX Power IC/MAXIM MIX Power IC) , TY-1 0.3 , TY-1 0.35 , TY-1 0.4 , TY-1 0.5 , CPU Stencil , MTK , MTK stencil , MSM8992 , MSM8996 , MSM8976 , MJ stencil , Mijing stencil , power ic stencil , MTK MT stencil |
Brand | Mijing |
Creation Time | 2019-03-29 |
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