Product Name | MECHANIC XGSP80 Soldering Paste Flux XGSP80 Solder Tin Sn63/Pb67 For Soldering iron Circuit Board SMT SMD Repair Tool |
Item NO. | 944460 |
BGA reballing kit | Solder flux paste |
Weight | 0.05 kg = 0.1102 lb = 1.7637 oz |
Category | Phone repair tools > BGA reballing kit |
Tag | XGSP50 , XGSP80 , XGSP200 , XGSP 500 , XG30 , XG40 , XG50 , XGSP40 , XGSP30 , solder paste , solder flux , solder paste flux , solder flux paste |
Brand | MECHANIC |
Creation Time | 2019-05-21 |
Product parameters:
XG50(35G)183°
XG40(30G)183°
XG30(16G)183°
XGSP50(42G)183°
XGSP40(35G)183°
XGSP30(20G)183°
XGSP80(60G)183°
XGSP200(200G)183°
XGSP500(500G)183°
XGSP200(200G)183°
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