| Product Name | BGA Stencil for Samsung Exynos 9610 CPU Reballing Planting Tin Mesh, BGA Stencil Repair |
| Item NO. | 1590021 |
| BGA reballing kit | Stencil |
| Weight | 0.04 kg = 0.0882 lb = 1.4110 oz |
| Category | Phone repair tools > BGA reballing kit |
| Tag | BGA stencils , Exynos 9610 CPU reballing stencils , Exynos 9610 CPU tin planting stencil , Exynos 9610 CPU tin planting stencils |
| Brand | iRepair |
| Creation Time | 2020-11-10 |
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