| Product Name | MIJNNG iRepair HY-258 LO Solder paste solder paste mobile phone maintenance environmental protection lead-free antioxidant |
| Item NO. | 1616506 |
| Glue liquid solution | Repair glue |
| Weight | 0.11 kg = 0.2425 lb = 3.8801 oz |
| Category | Phone repair tools > BGA reballing kit |
| Tag | solder paste , bga welding , HY-258 , irepair solder paste |
| Brand | iRepair |
| Creation Time | 2020-12-03 |




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