| Product Name | MECHANIC Lead-free high/medium/low temperature solder paste for PCB SMT BGA Reballing Phone IC Chip Mainboard Repair with Putter |
| Item NO. | 1769430 |
| Weight | 0.3 kg = 0.6614 lb = 10.5822 oz |
| Category | Phone repair tools > BGA reballing kit |
| Tag | solder paste , soldering paste , paste , desoldering paste , mechanic paste |
| Brand | MECHANIC |
| Creation Time | 2021-05-07 |








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