USD

AddressCompany:Shenzhen Tuoli Electronic Technology Co.,Ltd.
Address:Floor 6, Building B, Baifuli Industrial Park, Shanghenglang Industrial Zone,
Dalang Street, Longhua District, Shenzhen
Service Hotline:008618899777586 （WhatsApp）
E-mail:Service@tuolitech.com


All Categories

AMAOE BGA Reballing Stencil For Vivo X70Pro+ Motherboard Middle Layer Tin Planting Steel Mesh Chip Solder Template 0.12mm

Copy and share this link on social network or send it to your friends

Copy

AMAOE BGA Reballing Stencil For Vivo X70Pro+ Motherboard Middle Layer Tin Planting Steel Mesh Chip Solder Template 0.12mm Item NO.: 2024283

Write a Review
US$ 2.20
Quantity:
Stock ( 9999999 )
Shipping Cost:
Estimate Shipping Cost
Add to Cart
Product Name AMAOE BGA Reballing Stencil For Vivo X70Pro+ Motherboard Middle Layer Tin Planting Steel Mesh Chip Solder Template 0.12mm
Item NO. 2024283
BGA reballing kit Stencil
Weight 0.04 kg = 0.0882 lb = 1.4110 oz
Category Phone repair tools
Tag Stencil , Steel Mesh , BGA reballing stencil , AMAOE , Planting Steel Mesh , Vivo X70Pro+ , X70Pro+
Brand AMAOE
Creation Time 2022-05-16

No related record found

You May Also Like

Recently Viewed

Privacy Clause
About Us
About Us
Contact Us

AddressCompany:Shenzhen Tuoli Electronic Technology Co.,Ltd.
Address:Floor 6, Building B, Baifuli Industrial Park, Shanghenglang Industrial Zone,
Dalang Street, Longhua District, Shenzhen
Service Hotline:008618899777586 （WhatsApp）
E-mail:Service@tuolitech.com