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AddressCompany:Shenzhen Tuoli Electronic Technology Co.,Ltd.
Address:Floor 6, Building B, Baifuli Industrial Park, Shanghenglang Industrial Zone,
Dalang Street, Longhua District, Shenzhen
Service Hotline:008618899777586 （WhatsApp）
E-mail:Service@tuolitech.com


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MaAnt CPU BGA Reballing Stencil Kit For Qualcomm HiSilicon MTK Android Phone Motherboard CPU IC Planting Tin Template Steel Mesh

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MaAnt CPU BGA Reballing Stencil Kit For Qualcomm HiSilicon MTK Android Phone Motherboard CPU IC Planting Tin Template Steel Mesh Item NO.: 2052548

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Product Name MaAnt CPU BGA Reballing Stencil Kit For Qualcomm HiSilicon MTK Android Phone Motherboard CPU IC Planting Tin Template Steel Mesh
Item NO. 2052548
BGA reballing kit Stencil
Weight 0.2 kg = 0.4409 lb = 7.0548 oz
Category Phone repair tools > BGA reballing kit
Tag MaAnt , LCD Stencil , LCD IC flex cable stencil , lcd protection stencil
Brand MaAnt
Creation Time 2022-07-15

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AddressCompany:Shenzhen Tuoli Electronic Technology Co.,Ltd.
Address:Floor 6, Building B, Baifuli Industrial Park, Shanghenglang Industrial Zone,
Dalang Street, Longhua District, Shenzhen
Service Hotline:008618899777586 （WhatsApp）
E-mail:Service@tuolitech.com