Mechanic Heat kit Reflow Soldering Heating Platform for iPhone X-14promax modules/Motherboard heat separation/Big Screen Item NO.: 2059938

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Product Name	Mechanic Heat kit Reflow Soldering Heating Platform for iPhone X-14promax modules/Motherboard heat separation/Big Screen
Item NO.	2059938
Motherboard parts	Motherboard metal parts
Weight	1.5 kg = 3.3069 lb = 52.9109 oz
Category	Phone repair tools > BGA reballing kit
Tag	Preheater , desoldering station , Mechanic mobile phone motherboard , Mechanic mobile phone motherboard glue removal , glue removal disassembly layering bonding tin planting intellige , heat kit , mechanic preheater
Creation Time	2022-08-20