Product Name | Applicable to Samsung ZFlip3 5G middle layer tin planting mesh SM-F711U/B/N/0/D/W Amao |
Item NO. | 2179515 |
BGA reballing kit | Stencil |
Weight | 0.04 kg = 0.0882 lb = 1.4110 oz |
Category | Phone repair tools > BGA reballing kit |
Tag | Applicable to Samsung ZFlip3 5G middle layer tin planting mesh , SM-F711U/B/N/0/D/W Amao , Samsung ZFlip3 5G |
Creation Time | 2022-12-28 |
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