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AddressCompany:Shenzhen Tuoli Electronic Technology Co.,Ltd.
Address:Floor 6, Building B, Baifuli Industrial Park, Shanghenglang Industrial Zone,
Dalang Street, Longhua District, Shenzhen
Service Hotline:008618899777586 （WhatsApp）
E-mail:Service@tuolitech.com


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Applicable to Samsung ZFlip3 5G middle layer tin planting mesh SM-F711U/B/N/0/D/W Amao

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Applicable to Samsung ZFlip3 5G middle layer tin planting mesh SM-F711U/B/N/0/D/W Amao Item NO.: 2179515

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Product Name Applicable to Samsung ZFlip3 5G middle layer tin planting mesh SM-F711U/B/N/0/D/W Amao
Item NO. 2179515
BGA reballing kit Stencil
Weight 0.04 kg = 0.0882 lb = 1.4110 oz
Category Phone repair tools > BGA reballing kit
Tag Applicable to Samsung ZFlip3 5G middle layer tin planting mesh , SM-F711U/B/N/0/D/W Amao , Samsung ZFlip3 5G
Creation Time 2022-12-28

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AddressCompany:Shenzhen Tuoli Electronic Technology Co.,Ltd.
Address:Floor 6, Building B, Baifuli Industrial Park, Shanghenglang Industrial Zone,
Dalang Street, Longhua District, Shenzhen
Service Hotline:008618899777586 （WhatsApp）
E-mail:Service@tuolitech.com