| Product Name | Mijing thermal crease TG650 CPU Thermal paste |
| Item NO. | 2188882 |
| BGA reballing kit | Solder flux paste |
| Weight | 0.01 kg = 0.0220 lb = 0.3527 oz |
| Category | Phone repair tools > BGA reballing kit |
| Tag | MIJING , TG650 , thermal crease , mijing thermal crease , Thermal paste , MJ glue |
| Brand | Mijing |
| Creation Time | 2022-12-29 |


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