Product Name | KGX-602 lead free 138℃ low temprature solder paste |
Item NO. | 2213099 |
BGA reballing kit | Solder flux paste |
Weight | 0.1 kg = 0.2205 lb = 3.5274 oz |
Category | Phone repair tools > BGA reballing kit |
Tag | solder paste , 138℃ , KGX , KGX-602 , KGX solder paste |
Brand | KGX |
Creation Time | 2023-02-22 |
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