Product Name | XZZ Tin Paste for Cell Phone Repair /Melting Point Welding Flux Repair PCB BGA CPU LED Rework/Soldering paste |
Item NO. | 2333534 |
BGA reballing kit | Solder flux paste |
Weight | 0.061 kg = 0.1345 lb = 2.1517 oz |
Category | Phone repair tools > BGA reballing kit |
Tag | BGA , PCB , tin paste , flux , welding flux , XZZ |
Creation Time | 2023-10-20 |
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