Product Name | JITONGXUE 18 In1 Middle Layer Positioning Silicone Tin Planting Platform For IPX-14 Series CPU Chips BGA Reballing Stencil Kit |
Item NO. | 2451713 |
BGA reballing kit | Tin planting platform |
Weight | 0.4 kg = 0.8818 lb = 14.1096 oz |
Category | Phone repair tools > Rework stations & tools |
Tag | middle layer , planting platform , JITONGXUE , 18 In1 , Positioning Silicone , BGA Reballing Stencil Kit |
Creation Time | 2024-01-08 |
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