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AddressCompany:Shenzhen Tuoli Electronic Technology Co.,Ltd.
Address:Floor 6, Building B, Baifuli Industrial Park, Shanghenglang Industrial Zone,
Dalang Street, Longhua District, Shenzhen
Service Hotline:008618899777586 (WhatsApp)
E-mail:Service@tuolitech.com


JITONGXUE 18 In1 Middle Layer Positioning Silicone Tin Planting Platform For IPX-14 Series CPU Chips BGA Reballing Stencil Kit

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JITONGXUE 18 In1 Middle Layer Positioning Silicone Tin Planting Platform For IPX-14 Series CPU Chips BGA Reballing Stencil Kit Item NO.: 2451713

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Product Name JITONGXUE 18 In1 Middle Layer Positioning Silicone Tin Planting Platform For IPX-14 Series CPU Chips BGA Reballing Stencil Kit
Item NO. 2451713
BGA reballing kit Tin planting platform
Weight 0.4 kg = 0.8818 lb = 14.1096 oz
Category Phone repair tools > Rework stations & tools
Tag middle layer , planting platform , JITONGXUE , 18 In1 , Positioning Silicone , BGA Reballing Stencil Kit
Creation Time 2024-01-08

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