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AddressCompany:Shenzhen Tuoli Electronic Technology Co.,Ltd.
Address:Floor 6, Building B, Baifuli Industrial Park, Shanghenglang Industrial Zone,
Dalang Street, Longhua District, Shenzhen
Service Hotline:008618899777586 （WhatsApp）
E-mail:Service@tuolitech.com


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512G BGA Reballing Stencil For iPhone 6-X/11/12/13 14/15 IC Chip Planting Tin Template Steel Mesh

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512G BGA Reballing Stencil For iPhone 6-X/11/12/13 14/15 IC Chip Planting Tin Template Steel Mesh Item NO.: 2458858

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US$ 1.83
Model:
6/6p 6s/6sp 7/7p 8/8p/x xs/xr/xsmax 11/11pro/11promax 12/12pro/12promax 13/13pro/13promax 14/14plus/14pro/14promax 15/15plus/15pro/15promax
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Product Name 512G BGA Reballing Stencil For iPhone 6-X/11/12/13 14/15 IC Chip Planting Tin Template Steel Mesh
Item NO. 2458858
BGA reballing kit Stencil
Weight 0.04 kg = 0.0882 lb = 1.4110 oz
Category Phone repair tools > BGA reballing kit
Tag Stencil , Steel Mesh , BGA reballing
Creation Time 2024-01-26

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AddressCompany:Shenzhen Tuoli Electronic Technology Co.,Ltd.
Address:Floor 6, Building B, Baifuli Industrial Park, Shanghenglang Industrial Zone,
Dalang Street, Longhua District, Shenzhen
Service Hotline:008618899777586 （WhatsApp）
E-mail:Service@tuolitech.com