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AddressCompany:Shenzhen Tuoli Electronic Technology Co.,Ltd.
Address:Floor 6, Building B, Baifuli Industrial Park, Shanghenglang Industrial Zone,
Dalang Street, Longhua District, Shenzhen
Service Hotline:008618899777586 （WhatsApp）
E-mail:Service@tuolitech.com


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Amaoe BGA reballing stencil middle-layer CPU of Apple iPhone 18 Pro / Pro Max / Duo / A20 Pro

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Amaoe BGA reballing stencil middle-layer CPU of Apple iPhone 18 Pro / Pro Max / Duo / A20 Pro Item NO.: 2765654

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US$ 2.25
model:
IP 18-A20/A20Pro IP18/Pro/Pro Max/Duo Multifunctional Stencil 0.12mm A20Pro CPU+RAM Integrated Positioning Stencil A20Pro Bottom-Layer Stencil (CPU) 0.12mm – Half-Etched A20Pro Bottom-Layer Stencil (CPU) 0.12mm – Fully Etched (Through-Hole) IP18Pro/18ProMax Middle-Layer Positioning Stencil IP18Pro/18ProMax Middle-Layer Stencil – 0.12mm IP18Pro/18ProMax 2-in-1 Middle-Layer Reballing Platform
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Product Name Amaoe BGA reballing stencil middle-layer CPU of Apple iPhone 18 Pro / Pro Max / Duo / A20 Pro
Item NO. 2765654
Weight 1.25 kg = 2.7558 lb = 44.0925 oz
Category Phone repair tools > BGA reballing kit
Brand AMAOE
Creation Time 2026-11-10

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AddressCompany:Shenzhen Tuoli Electronic Technology Co.,Ltd.
Address:Floor 6, Building B, Baifuli Industrial Park, Shanghenglang Industrial Zone,
Dalang Street, Longhua District, Shenzhen
Service Hotline:008618899777586 （WhatsApp）
E-mail:Service@tuolitech.com