| Product Name | MECHANIC Apple mobile phone XGS special lead low temperature solder paste tin paste non-oxidized tin mud |
| Item NO. | 395038 |
| BGA reballing kit | Solder flux paste |
| Weight | 0.1 kg = 0.2205 lb = 3.5274 oz |
| Category | Phone repair tools > BGA reballing kit |
| Tag | XGS20 , XGS35 , XGS40 , XGS60 , solder paste , tin paste , solder tin paste , low temperature solder paste |
| Brand | MECHANIC |
| Creation Time | 2019-07-29 |

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