SP-X Middle Layer BGA motherboard Special Solder Paste Mainboard Repair Stannum Planting Plant Tin flux Item NO.: 1311967

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Product Name	SP-X Middle Layer BGA motherboard Special Solder Paste Mainboard Repair Stannum Planting Plant Tin flux
Item NO.	1311967
Tools and Consumables	Solder paste flux
Weight	0.18 kg = 0.3968 lb = 6.3493 oz
Category	Phone repair tools > BGA reballing kit
Tag	solder paste , solder paste flux , soldering paste , SP-X , SPX , Relife solder paste , X solder paste , middle layer solder paste , motherboard middle layer solder paste , SP X
Brand	RELIFE
Creation Time	2020-06-12