| Product Name | AMAOE U9 CPU reballing kit 0.12MM MSM8905/8909 steel mesh / U9 position plate / magnetic base |
| Item NO. | 1318968 |
| Smart device Brand | Android, Samsung |
| BGA reballing kit | Stencil |
| Weight | 0.55 kg = 1.2125 lb = 19.4007 oz |
| Category | Phone repair tools > BGA reballing kit |
| Tag | CPU Stencil , MSM stencil , MSM8909 , Android stencil , 0.12mm stencil , 0.12mm , Android CPU stencil , Samsung CPU stencil , Samsung stencil , Magnetic base , MSM , AMAOE CPU stencil , 0.12mm CPU stencil , MSM CPU stencil , AMAOE 0.12MM stencil , AMAOE magnetic base , 0.12MM steel mesh , 8909 , U9 , U9 position plate , MSM8905/8909 , MSM8905/8909 stencil , MSM8905 , MSM8905 stencil , 8905 , MSM8909 stencil |
| Brand | AMAOE |
| Creation Time | 2020-06-22 |


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