Product Name | AMAOE U8 CPU reballing kit for SAMSUNG 7885 CPU 0.10MM steel mesh / magnetic base / U8 position plate |
Item NO. | 1318927 |
Smart device Brand | Android, Samsung |
BGA reballing kit | Stencil |
Weight | 0.55 kg = 1.2125 lb = 19.4007 oz |
Category | Phone repair tools > BGA reballing kit |
Tag | 0.10mm , MSM stencil , Android stencil , Android CPU stencil , Samsung CPU stencil , Samsung stencil , Magnetic base , MSM , MSM CPU stencil , 0.10MM stencil , 0.10MM CPU stencil , U8 position plate , U8 , U8 position platform , 7885 , SAMSUNG 7885 CPU , SAMSUNG 7885 CPU stencil , 0.10MM steel mesh |
Brand | AMAOE |
Creation Time | 2020-06-22 |
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