Lead-Free Tin Paste Low Temperature And High Temperature Melting Point Tin Paste CPU Repair Item NO.: 944842

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US$ 1.71

Model:: V3B45(20G) 138° V4B45(40G)138° V5B45(42G)138° V4B45(35G)138° V8B45(60G)138° V3S35(20G)217° V4S35(35G)217° V5S35(42G)217° V8S35(60G)217° V4S35(40G)217° V4B48 [35G] 138℃ V4S38 [35G] 217℃

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Product Name	Lead-Free Tin Paste Low Temperature And High Temperature Melting Point Tin Paste CPU Repair
Item NO.	944842
BGA reballing kit	Solder flux paste
Weight	0.07 kg = 0.1543 lb = 2.4692 oz
Category	Phone repair tools > BGA reballing kit
Tag	V8B45 , V5B45 , V3B45 , V4B45 , V8S35 , V5S35 , V4S35 , V3S35 , solder paste , solder flux , lead free paste , 138℃ , 138°
Brand	MECHANIC
Creation Time	2019-05-21