Product Name | Applicable to Samsung ZFLIP4 mid-layer tin planting network SM-F721U/B/n/0/d/w/be/w7023 A Mao Yixiu |
Item NO. | 2237627 |
BGA reballing kit | Stencil |
Weight | 0.04 kg = 0.0882 lb = 1.4110 oz |
Category | Phone repair tools > BGA reballing kit |
Tag | Stencil , Samsung , SM , AMAOE , TIN PLANTING , ZFLIP4 , mid-layer , tin planting network , F721U |
Brand | AMAOE |
Creation Time | 2023-04-21 |
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