Applicable to Samsung ZFLIP4 mid-layer tin planting network SM-F721U/B/n/0/d/w/be/w7023 A Mao Yixiu Item NO.: 2237627

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Product Name	Applicable to Samsung ZFLIP4 mid-layer tin planting network SM-F721U/B/n/0/d/w/be/w7023 A Mao Yixiu
Item NO.	2237627
BGA reballing kit	Stencil
Weight	0.04 kg = 0.0882 lb = 1.4110 oz
Category	Phone repair tools > BGA reballing kit
Tag	Stencil , Samsung , SM , AMAOE , TIN PLANTING , ZFLIP4 , mid-layer , tin planting network , F721U
Brand	AMAOE
Creation Time	2023-04-21