| Product Name | AMAOE QU:5 Qualcomm CPU reballing stencil 0.12MM SDM845 SM8150 SDM670 SDM710 MSM8917 SM6150 QU5 CPU steel mesh 0.12MM |
| Item NO. | 1318323 |
| Smart device Brand | Android, Samsung |
| BGA reballing kit | Stencil |
| Weight | 0.04 kg = 0.0882 lb = 1.4110 oz |
| Category | Phone repair tools > BGA reballing kit |
| Tag | SDM845 stencil , SM , 6150 , SDM , SM8150 , MSM stencil , SDM stencil , CPU steel mesh , Android stencil , SDM845 , 0.12mm stencil , 0.12mm , 710 , 845 , 670 , SDM845 CPU , MSM8917 , Android CPU stencil , Samsung CPU stencil , Qualcomm CPU stencil , Samsung stencil , Qualcomm , 8150 , MSM , 0.12mm CPU stencil , SDM710 , SDM710 stencil , Qualcomm stencil , MSM8917 stencil , 8917 , SM stencil , SM8150 RAM , SM8150 CPU , AMAOE 0.12MM stencil , QU5 , SDM670 , SM6150 , SDM845 CPU stencil , SDM845 RAM , SDM845 RAM stencil , SM8150 CPU stencil , SM8150 RAM stencil , SDM670 stencil , SM6150 stencil |
| Brand | AMAOE |
| Creation Time | 2020-06-22 |
No related record found