AMAOE MP:1 Qualcomm PM MTK MT Power IC 0.12MM reballing stencil MT6355W MT6356W MT6357V MT6358W PM660 PM670 MP6335 PM545 PM540 PMI632 PM640 MT6336 MT6330 MT6370P MT6371P MP1 steel mesh Item NO.: 1318294

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Product Name	AMAOE MP:1 Qualcomm PM MTK MT Power IC 0.12MM reballing stencil MT6355W MT6356W MT6357V MT6358W PM660 PM670 MP6335 PM545 PM540 PMI632 PM640 MT6336 MT6330 MT6370P MT6371P MP1 steel mesh
Item NO.	1318294
Smart device Brand	Android, Samsung
BGA reballing kit	Stencil
Weight	0.04 kg = 0.0882 lb = 1.4110 oz
Category	Phone repair tools > BGA reballing kit
Tag	660 , PM , MTK , MTK stencil , 640 , Android stencil , 0.12mm stencil , 0.12mm , PM640 , PM540 , PM670 , PM660 , MT6356W , MT6371P , power ic , power ic stencil , 540 , 670 , 6356 , power stencil , MT , 6371 , Samsung stencil , Qualcomm , MT6357 , 6357 , PM stencil , MT stencil , Android power stencil , MP1 , Qualcomm stencil , PMI632 , 632 , AMAOE 0.12MM stencil , Samsung 0.12MM stencil , Samsung power stencil , Samsung power ic stencil , Android power ic stencil , AMAOE power stencil , MT6355W , MT6355 , 6355 , MT6356 , MT6357V , MT6358W , MT6358 , 6358 , MP6335 , 6335 , PM545 , 545 , MT6336 , 6336 , MT6330 , 6330 , MT6370P , 6370P , MT6370 , 6370 , MT6371 , 6371P
Brand	AMAOE
Creation Time	2020-06-22