Product Name | AMAOE MQ:1 MQ:2 MQ:3 Qualcomm MTK CPU reballing stencil MT6771V MT6757V SDM845 SDM710 SDM660 MT6739V MT6763V 0.12MM stencil |
Item NO. | 1318315 |
Smart device Brand | Android, Samsung |
BGA reballing kit | Stencil |
Weight | 0.04 kg = 0.0882 lb = 1.4110 oz |
Category | Phone repair tools > BGA reballing kit |
Tag | CPU Stencil , 660 , Steel Mesh , MTK , MTK stencil , SDM660 , MTK CPU stencil , MT6739V , MT6763V , MT6757V , MT6771V , SDM845 , 0.12mm stencil , 0.12mm , 710 , 845 , MT6771 , Android CPU stencil , Samsung CPU stencil , Qualcomm CPU stencil , 6757 , Qualcomm , AMAOE CPU stencil , 6771 , MT6763 , 6763 , 0.12mm CPU stencil , MQ1 , 6757V , SDM710 , Qualcomm stencil , 0.12MM steel mesh , 6763V , MT6739 , 6739V , 6739 , MT6757 , 6771V |
Brand | AMAOE |
Creation Time | 2020-06-22 |
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