Product Name | AMAOE CPU reballing stencil kit U3 platform 0.12MM steel mesh for HI6250 MSM8916/8939 MSM8937/8940 MSM8952 MSM8953 B01 |
Item NO. | 1318718 |
Smart device Brand | Android, Samsung |
BGA reballing kit | Stencil |
Weight | 0.3 kg = 0.6614 lb = 10.5822 oz |
Category | Phone repair tools > BGA reballing kit |
Tag | MSM8916 Stencil , MSM8953 Stencil , CPU Stencil , 8916 , 8952 , HI , 8937 , 8953 , 8940 , U3 , MSM stencil , MSM8940 , MSM8952 , MSM8953 , MSM8916 , HI6250 , HI stencil , 0.12mm stencil , 0.12mm , Android CPU stencil , Samsung CPU stencil , MSM8939 , MSM , AMAOE CPU stencil , 0.12mm CPU stencil , 8939 , 6250 , HI6250 stencil , MSM8939 stencil , MSM8952 stencil , MSM8953 B01 , MSM8953 B01 stencil , U3 platform , U3 base , MSM8916/8939 , MSM8916/8939 stencil , MSM8937/8940 , MSM8937/8940 stencil , MSM8937 , MSM8937 stencil , MSM8940 stencil |
Brand | AMAOE |
Creation Time | 2020-06-22 |
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