| Product Name | AMAOE Qualcomm CPU reballing stencil 0.12MM QU:1 QU:2 QU:3 QU:4 Qualcomm MSM series steel mesh QU1 QU2 QU3 QU4 |
| Item NO. | 1318906 |
| Smart device Brand | Android, Samsung |
| BGA reballing kit | Stencil |
| Weight | 0.04 kg = 0.0882 lb = 1.4110 oz |
| Category | Phone repair tools > BGA reballing kit |
| Tag | 8916 , 8952 , 660 , 8937 , 8953 , 8998 , 8940 , SDM , MSM stencil , SDM stencil , CPU steel mesh , MSM8992 , MSM8996 , MSM8976 , MSM8928 , MSM8994 , MSM8960 , MSM8974 , MSM8998 , MSM8940 , SDM660 , MSM8952 , MSM8953 , MSM8909 , Android stencil , MSM8916 , 0.12mm stencil , 0.12mm , 8994 , 8996 , Android CPU stencil , Samsung CPU stencil , Qualcomm CPU stencil , Samsung stencil , 8976 , Qualcomm , 8992 , MSM , AMAOE CPU stencil , 0.12mm CPU stencil , Qualcomm CPU , MSM CPU stencil , 8974 , Qualcomm stencil , 8928 , AMAOE 0.12MM stencil , 8909 , 8960 , MSM7225A , 7225A , 7225 , MSM8937 , QU1 , QU2 , QU3 , QU4 , MSM series stencil , MSM8912 , 8912 |
| Brand | AMAOE |
| Creation Time | 2020-06-22 |
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