AMAOE RAM:1 RAM:2 CPU up layer reballing stencil 0.18MM HI MSM BGA RAM steel mesh RAM1 RAM2 Item NO.: 1318893

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Product Name	AMAOE RAM:1 RAM:2 CPU up layer reballing stencil 0.18MM HI MSM BGA RAM steel mesh RAM1 RAM2
Item NO.	1318893
Smart device Brand	Android, Samsung
BGA reballing kit	Stencil
Weight	0.04 kg = 0.0882 lb = 1.4110 oz
Category	Phone repair tools > BGA reballing kit
Tag	BGA , HI , SDM , Hi3680 , MSM stencil , SDM stencil , BGA stencil , MSM8992 , MSM8996 , MSM8928 , MSM8974 , MSM8998 , Android stencil , SDM845 , MSM8956 , MT6797 , HI3650 , HI stencil , HI6260 , HI3670 , MT , Samsung stencil , MSM , BGA136 , BGA168 , MT stencil , RAM , MSM8909W , 0.18MM , 0.18MM stencil , AMAOE 0.18MM stencil , RAM stencil , RAM1 , RAM2 , Samsung RAM stencil , Android RAM stencil , RAM steel mesh , 0.18MM RAM stencil , BGA216 , BGA256 , BGA366 , BGA556 , BGA272 , BGA320 , BGA196 , BGA376 , 7885 RAM , HI RAM stencil , MSM RAM stencil , MT RAM stencil , SDM RAM stencil
Brand	AMAOE
Creation Time	2020-06-22