| Product Name | AMAOE Qualcomm CPU reballing stencil 0.12mm QU:7 |
| Item NO. | 2513126 |
| BGA reballing kit | Stencil, Tin planting platform |
| Weight | 0.04 kg = 0.0882 lb = 1.4110 oz |
| Category | Phone repair tools > BGA reballing kit |
| Tag | Stencil , AMAOE , CPU reballing stencil |
| Creation Time | 2024-06-03 |
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