USD

AddressCompany:Shenzhen Tuoli Electronic Technology Co.,Ltd.
Address:Floor 6, Building B, Baifuli Industrial Park, Shanghenglang Industrial Zone,
Dalang Street, Longhua District, Shenzhen
Service Hotline:008618899777586 （WhatsApp）
E-mail:Service@tuolitech.com


All Categories

AMAOE U-HIU2/3 BGA Reballing Stencil for HUAWEI Hi3690/80/3670/36A0RAM/Hi9500/CPU Magnetic Tin Planting Steel Mesh

Copy and share this link on social network or send it to your friends

Copy

AMAOE U-HIU2/3 BGA Reballing Stencil for HUAWEI Hi3690/80/3670/36A0RAM/Hi9500/CPU Magnetic Tin Planting Steel Mesh Item NO.: 2301771

Write a Review
US$ 16.92
Model:
U-HIU2 Set U-HIU3 Set
Quantity:
Stock ( 19999998 )
Shipping Cost:
Estimate Shipping Cost
Add to Cart
Product Name AMAOE U-HIU2/3 BGA Reballing Stencil for HUAWEI Hi3690/80/3670/36A0RAM/Hi9500/CPU Magnetic Tin Planting Steel Mesh
Item NO. 2301771
BGA reballing kit Stencil
Weight 0.81 kg = 1.7857 lb = 28.5719 oz
Category Phone repair tools > BGA reballing kit
Tag Stencil , Steel Mesh , BGA reballing , AMAOE , TIN PLANTING , U-HIU2/3
Brand AMAOE
Creation Time 2023-09-09

No related record found

You May Also Like

Recently Viewed

Privacy Clause
About Us
About Us
Contact Us

AddressCompany:Shenzhen Tuoli Electronic Technology Co.,Ltd.
Address:Floor 6, Building B, Baifuli Industrial Park, Shanghenglang Industrial Zone,
Dalang Street, Longhua District, Shenzhen
Service Hotline:008618899777586 （WhatsApp）
E-mail:Service@tuolitech.com