AMAOE U-HIU2/3 BGA Reballing Stencil for HUAWEI Hi3690/80/3670/36A0RAM/Hi9500/CPU Magnetic Tin Planting Steel Mesh Item NO.: 2301771

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Product Name	AMAOE U-HIU2/3 BGA Reballing Stencil for HUAWEI Hi3690/80/3670/36A0RAM/Hi9500/CPU Magnetic Tin Planting Steel Mesh
Item NO.	2301771
BGA reballing kit	Stencil
Weight	0.81 kg = 1.7857 lb = 28.5719 oz
Category	Phone repair tools > BGA reballing kit
Tag	Stencil , Steel Mesh , BGA reballing , AMAOE , TIN PLANTING , U-HIU2/3
Brand	AMAOE
Creation Time	2023-09-09