AMAOE Huawei Hi3690 5G lower layer reballing stencil 0.12MM CPU steel mesh Item NO.: 1317125

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Product Name	AMAOE Huawei Hi3690 5G lower layer reballing stencil 0.12MM CPU steel mesh
Item NO.	1317125
Smart device Brand	Android, Huawei
BGA reballing kit	Stencil
Weight	0.04 kg = 0.0882 lb = 1.4110 oz
Category	Phone repair tools > BGA reballing kit
Tag	CPU Stencil , HI , CPU steel mesh , Huawei stencil , HI stencil , 0.12mm stencil , 0.12mm , Huawei CPU stencil , AMAOE CPU stencil , 0.12mm CPU stencil , AMAOE 0.12MM stencil , Hi3690 , Hi3690 stencil , 3690 , Hi3690 5G , Hi3690 5G stencil
Brand	AMAOE
Creation Time	2020-06-19