Product Name | AMAOE M3-012 Huawei Mate30 5G motherboard middle layer 0.12MM reballing stencil |
Item NO. | 1317141 |
Smart device Brand | Android, Huawei |
BGA reballing kit | Stencil |
Weight | 0.04 kg = 0.0882 lb = 1.4110 oz |
Category | Phone repair tools > BGA reballing kit |
Tag | MATE30 , Huawei stencil , 0.12mm stencil , 0.12mm , M3 , AMAOE 0.12MM stencil , Huawei motherboard stencil , Huawei 0.12MM stencil , Mate30 stencil , Mate 30 , Mate 30 stencil , M3-012 , M3 012 , M3012 , Huawei motherboard middle layer stencil , Huawei Mate30 5G , Huawei Mate30 5G stencil , Mate30 5G , Mate30 5G stencil , Mate 30 5G , Mate 30 5G stencil , Huawei Mate30 5G motherboard middle layer , Huawei Mate30 5G motherboard stencil , Mate30 motherboard stencil , motherboard stencil , AMAOE motherboard stencil |
Brand | AMAOE |
Creation Time | 2020-06-19 |
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