AMAOE Huawei P30Pro 0.10MM motherboard middle layer tin planting steel net reballing stencil Item NO.: 1316980

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Product Name	AMAOE Huawei P30Pro 0.10MM motherboard middle layer tin planting steel net reballing stencil
Item NO.	1316980
Smart device Brand	Android, Huawei
BGA reballing kit	Stencil
Weight	0.04 kg = 0.0882 lb = 1.4110 oz
Category	Phone repair tools > BGA reballing kit
Tag	P30PRO , 0.1mm , 0.10mm , Huawei stencil , P30 Pro , 0.1mm stencil , middle layer stencil , AMAOE stencil , 0.10MM stencil , Huawei P30Pro , Huawei P30Pro stencil , P30Pro stencil , Huawei middle layer stencil , AMAOE middle layer stencil , P30 pro stencil
Brand	AMAOE
Creation Time	2020-06-19