| Product Name | Jitongxue board removal kit Soldering stencil IP 8-16PM CPU reballing platform |
| Item NO. | 1317086 |
| Smart device Brand | Android, Huawei |
| BGA reballing kit | Stencil |
| Weight | 0.04 kg = 0.0882 lb = 1.4110 oz |
| Category | Phone repair tools > BGA reballing kit |
| Tag | HI6260 , 0.12mm stencil , 0.12mm , Huawei CPU stencil , AMAOE CPU stencil , 0.12mm CPU stencil , AMAOE stencil , Hi6260 stencil , 6260 , AMAOE 0.12MM stencil , Hi6260 V101 , AMAOE Huawei stencil , Hi6260 V101 stencil , V101 |
| Creation Time | 2020-06-19 |




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