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AddressCompany:Shenzhen Tuoli Electronic Technology Co.,Ltd.
Address:Floor 6, Building B, Baifuli Industrial Park, Shanghenglang Industrial Zone,
Dalang Street, Longhua District, Shenzhen
Service Hotline:008618899777586 (WhatsApp)
E-mail:Service@tuolitech.com


YCS Multi-Purpose BGA Reballing Stencil for iPhone Android Series Universal CPU Comprehensive 0.12mm BGA Reballing Stencil

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YCS Multi-Purpose BGA Reballing Stencil for iPhone Android Series Universal CPU Comprehensive 0.12mm BGA Reballing Stencil Item NO.: 1315437

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US$ 1.49
Model:
Tin-planting arc pad IP Net-01 IP Net-02 IP Net-03 IP Net-04 IP Net-05 IP Net-06
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Product Name YCS Multi-Purpose BGA Reballing Stencil for iPhone Android Series Universal CPU Comprehensive 0.12mm BGA Reballing Stencil
Item NO. 1315437
Smart device Brand Android, Oppo, Vivo, XiaoMi
BGA reballing kit Stencil
Weight 0.04 kg = 0.0882 lb = 1.4110 oz
Category Phone repair tools > BGA reballing kit
Tag CPU Stencil , Stencil , 660 , OP1 , SDM660 , Vivo stencil , Mi stencil , Xiaomi stencil , 0.12mm stencil , X20 , R11 , Xiaomi CPU stencil , Oppo stencil , Mi CPU stencil , Oppo CPU stencil , Vivo CPU stencil , 0.12mm CPU stencil , AMAOE stencil , R11 stencil , X20 stencil , SDM660 stencil , R11 series stencil , Mi Note3 stencil , Mi Note3
Brand YCS
Creation Time 2020-06-17

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