Product Name | YCS Multi-Purpose BGA Reballing Stencil for iPhone Android Series Universal CPU Comprehensive 0.12mm BGA Reballing Stencil |
Item NO. | 1315437 |
Smart device Brand | Android, Oppo, Vivo, XiaoMi |
BGA reballing kit | Stencil |
Weight | 0.04 kg = 0.0882 lb = 1.4110 oz |
Category | Phone repair tools > BGA reballing kit |
Tag | CPU Stencil , Stencil , 660 , OP1 , SDM660 , Vivo stencil , Mi stencil , Xiaomi stencil , 0.12mm stencil , X20 , R11 , Xiaomi CPU stencil , Oppo stencil , Mi CPU stencil , Oppo CPU stencil , Vivo CPU stencil , 0.12mm CPU stencil , AMAOE stencil , R11 stencil , X20 stencil , SDM660 stencil , R11 series stencil , Mi Note3 stencil , Mi Note3 |
Brand | YCS |
Creation Time | 2020-06-17 |
No related record found