| Product Name |
YCS Multi-Purpose BGA Reballing Stencil for iPhone Android Series Universal CPU Comprehensive 0.12mm BGA Reballing Stencil |
| Item NO. |
1315437 |
| Smart device Brand |
Android, Oppo, Vivo, XiaoMi |
| BGA reballing kit |
Stencil |
| Weight |
0.04 kg = 0.0882 lb = 1.4110 oz |
| Category |
Phone repair tools
> BGA reballing kit
|
| Tag |
CPU Stencil
, Stencil
, 660
, OP1
, SDM660
, Vivo stencil
, Mi stencil
, Xiaomi stencil
, 0.12mm stencil
, X20
, R11
, Xiaomi CPU stencil
, Oppo stencil
, Mi CPU stencil
, Oppo CPU stencil
, Vivo CPU stencil
, 0.12mm CPU stencil
, AMAOE stencil
, R11 stencil
, X20 stencil
, SDM660 stencil
, R11 series stencil
, Mi Note3 stencil
, Mi Note3
|
| Brand |
YCS |
| Creation Time |
2020-06-17 |
No related record found