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AddressCompany:Shenzhen Tuoli Electronic Technology Co.,Ltd.
Address:Floor 6, Building B, Baifuli Industrial Park, Shanghenglang Industrial Zone,
Dalang Street, Longhua District, Shenzhen
Service Hotline:008618899777586 （WhatsApp）
E-mail:Service@tuolitech.com


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AMAOE Mbga-B18 BGA Reballing Stencil Station Kit for Snapdragon CPU 855/845/ SDM845 SM8150 RAM556

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AMAOE Mbga-B18 BGA Reballing Stencil Station Kit for Snapdragon CPU 855/845/ SDM845 SM8150 RAM556 Item NO.: 2507476

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US$ 23.50
Model:
Mbga-B18
Quantity:
Stock ( 9999999 )
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Product Name AMAOE Mbga-B18 BGA Reballing Stencil Station Kit for Snapdragon CPU 855/845/ SDM845 SM8150 RAM556
Item NO. 2507476
BGA reballing kit Tin planting platform
Weight 0.61 kg = 1.3448 lb = 21.5171 oz
Category Phone repair tools > BGA reballing kit
Tag CPU , Stencil , BGA , BGA reballing , reballing stencil , AMAOE , Mbga-B18 , Mbga , B18
Brand AMAOE
Creation Time 2024-05-23

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AddressCompany:Shenzhen Tuoli Electronic Technology Co.,Ltd.
Address:Floor 6, Building B, Baifuli Industrial Park, Shanghenglang Industrial Zone,
Dalang Street, Longhua District, Shenzhen
Service Hotline:008618899777586 （WhatsApp）
E-mail:Service@tuolitech.com