AMAOE Mbga-B18 BGA Reballing Stencil Station Kit for Snapdragon CPU 855/845/ SDM845 SM8150 RAM556 Item NO.: 2507476

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Product Name	AMAOE Mbga-B18 BGA Reballing Stencil Station Kit for Snapdragon CPU 855/845/ SDM845 SM8150 RAM556
Item NO.	2507476
BGA reballing kit	Tin planting platform
Weight	0.61 kg = 1.3448 lb = 21.5171 oz
Category	Phone repair tools > BGA reballing kit
Tag	CPU , Stencil , BGA , BGA reballing , reballing stencil , AMAOE , Mbga-B18 , Mbga , B18
Brand	AMAOE
Creation Time	2024-05-23