| Product Name | AMAOE Mbga-B18 Plant tin platform Snapdragon 855/845/SDM845/SM8150/RAM556 steel mesh |
| Item NO. | 2246758 |
| Weight | 1.61 kg = 3.5494 lb = 56.7911 oz |
| Category | Phone repair tools > BGA reballing kit |
| Tag | Steel Mesh , SM8150 , Platform , SDM845 , 855 , amao , Mbga-B18 , Mbga , B18 , Plant tin , RAM556 |
| Brand | AMAOE |
| Creation Time | 2023-05-27 |




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